RayMing brings you reliable HDI printed circuit boards by ensuring meticulous planning in your stack-up. This strategic approach not only optimizes production costs but also accelerates your time-to-market through streamlined design efficiency. And in terms of reliability, microvias out-perform typical through-holes almost every time.

( HDI PCB Manufacturing Quote, Pls send detail to [email protected] )

  • Down to 1.5-mil trace space, 2-mil holes
  • Blind vias, buried vias, and microvias
  • Up to 4 lamination cycles
  • Fine lines and via-in-pad technology

Cutting-edge HDI printed circuit boards

With a commitment to innovation, RayMing offers HDI PCBs with cutting-edge specifications, including trace spaces down to 1.5 mil and holes as small as 2 mil. Embrace the advantages of blind vias, buried vias, and microvias, elevating the performance and density of your circuitry. Our capabilities extend to up to 4 lamination cycles, fine lines, and via-in-pad technology, providing you with a comprehensive suite of options to meet your project requirements.

Reliability is paramount in HDI printed circuit boards, and microvias stand out as a superior alternative to conventional through-holes. Enjoy enhanced signal integrity, reduced signal distortion, and improved overall performance. Trust RayMing’ seasoned engineers to guide you through the process, from efficient prototyping to the seamless manufacture of your high-density interconnect boards, all within the United States.

RayMing supports IPC-2581.

IPC-2581 is a crucial standard for the exchange of data in the manufacturing of high-density interconnect PCBs. This open, vendor-neutral XML format plays a vital role in the intricate structures of HDI printed circuit boards, facilitating the seamless exchange of design data including layer stack-up, drill details, and other specifications. By adhering to IPC-2581, designers and manufacturers ensure clear communication, reducing the likelihood of errors during data transfer. This standardized approach enhances collaboration, streamlines workflows, and contributes to the efficient and accurate production of complex HDI PCBs with precision and reliability.

Via capabilities for HDI PCBs
Via TypeVia parameterSierra Circuits capability
Blind ViaMin total pad size4 mils (.102 mm) over drill size
Min laser drill size4 mils (.102 mm)
Mechanically drilled annular ring4 mils (.102 mm) over drill size
Dielectric material thickness2 mils (.051 mm)
Capture pad size4 mils (.102 mm) over drill size
Laser aspect ratio.75:1
Buried ViaMin total pad size5 mils (.127 mm) over drill size
Min drill size6 mils (.152 mm) – depending on aspect ration
Capture pad size5 mils (.127 mm) over drill size
Laser aspect ratio.75:1
Through HoleMin total pad size5 mils (.127 mm) over drill size
Min drill size6 mils (.152 mm)
Capture pad size5 mils (.127 mm) over drill size
Max layer count26+
Min finish thickness.01″ (.254 mm)
Min trace width (I/L)3 mils (.076 mm)
Min trace width (O/L)3 mils (.076 mm)
Min space width (I/L)3 mils (.076 mm)
Min space width (O/L)3 mils (.076 mm)
Max lamination cycles4
Min hole size6 mils (.152 mm)
Min pitch.157″ (.4 mm)
Stacked viasYes
Staggered viasYes
Conductive filled viasYes
Non-conductive filled viasYes
Copper plate shut microviasYes
Heat sinksYes
UL 94V-0 (on selected materials)Yes
Quality reports for HDI PCBs
Report typeSierra Circuits capability
SpecificationsIPC-6012, class 1, 2, 3, & ESYes
IPC-6013, class 1, 2 & 3Yes
31032 MIL-PRF-55110 (on selected materials)Yes
Reports / CertificatesMicro sectionYes
SolderabilityYes
X-ray fluorescenceYes
Ionic contaminationYes
Time domain reflectometry (TDR)Yes
First article inspection (FAI)Yes
Certificate of compliance (C of C)Yes
Electrical testYes
Fabrication parameters for HDI PCBs
Fabrication parameterSierra Circuits capability
Panel sizes14×26″ (36×66 cm), 21×25″ (53×64 cm), 21x 29″ (53×74 cm), 12×18″ (30×46 cm), 18×24″ (46×61 cm), 16×18″ (41×46 cm)
Min board thickness.007″ (.178 mm)
Max board thickness.25″ (6.4 mm)
Thickness tolerance< 10%
Bow & twist tolerance< 7%
Min core thickness.002″ (0.51 mm)
Min dielectric.002″ (.051 mm)
Min starting copper foil weight9 micron (.009 mm)
Preferred materials for HDI PCBs
Material TypeRaw board manufacturerSierra Circuits capability
FR-4 Lead FreeIsola 370 HRYes
Ventec VT47Yes
Nan Ya NPG-170Yes
PolyimideIsola P95Yes
Nelco N7000-2 HTYes
Arlon 85NYes
Highspeed FR/MW ApplicationsIsola I-speedYes
FR 408HRRYes
Nelco N4000-13Yes
Nelco N4800-20Yes
TeflonNelco N9000-13 RFYes
Rogers RO3000 SeriesYes
Rogers RT/DUROID SeriesYes
Rogers ULTRALAM 2000Yes
CeramicRogers RO4003Yes
Rogers RO4350Yes
Rogers TTM 3, 4, 6, 10, 10iYes
Taconics CER-10Yes
Taconics RF-35, RF-35A2Yes
Taconics RF-60Yes
FlexDuPont Pyralux APYes
DuPont Pyralux LFYes
DuPont Pyralux FRYes
RigidLaird IMPCBYes
Drill parameters for HDI PCBs
Drill parameterSierra Circuits capability
Smallest laser drill diameter.003″ (.076 mm)
Largest laser drill diameter.010″ (.254 mm)
Max laser aspect ratio>.75:1
Min mechanical diameter.005″ (.127 mm)
Max mechanical aspect ratio> 10:1
Min mechanical drill to copper.005″ (.127 mm)
Min plated through hole tolerance+/- .002” (.051 mm)
Min non plated through hole tolerance+/- .001” (.025 mm)
Pad diameter parameters for HDI PCBs
Board TypePlacementSierra Circuits capability
RigidInner layerDrill + .008″ (.203 mm) + class 2
Outer layerDrill + .006″ (.152 mm) + class 2
FlexInner layerDrill + .010″ (.254 mm) + class 2
Outer layerDrill + .008″ (.203 mm) + class 2
Conductor parameters for HDI PCBs
FeatureConductor parameterSierra Circuits capability
Pad SizeMin pad size for electrical test.004″ (.102 mm)
Min wire bond pad size.004″ (.102 mm)
Min Trace Vs Copper Thickness Note: Thickness includes starting foil plus panel plates (for wrap if any) to be etched.5 microns.002″ (.051 mm)
9 microns.0025″ (.064 mm)
3/8 oz.003″ (.076 mm)
1/2 oz.0035″ (.089 mm)
1 oz.0045″ (.114 mm)
2 oz.006″ (.152 mm)
3 oz.0065″ (.165 mm)
> 3 ozContact us
Min Space Vs Copper Thickness Note: Thickness includes starting foil plus panel plates (for wrap if any) to be etched.5 microns.0025″ (.064 mm)
9 microns.003″ (.076 mm)
3/8 oz.0035″ (.089 mm)
1/2 oz.004″ (.102 mm)
1 oz.005″ (.126 mm)
2 oz.0065″ (.165 mm)
3 oz.007″ (.178 mm)
> 3 ozContact us
Permanent solder mask parameters for HDI PCBs
TypeSolder mask parameterSierra Circuits capability
Liquid Photoimageable (LPI)ColorsGreen, red, blue, yellow
GlossSemi-gloss, matte (only in green)
Min dam/web size SMT.004″ (.102 mm)
Min dam/web size BGA.0035″ (.089 mm)
Clearance>.0005″ (.013 mm)
Mask-defined SMT Or BGA (not ground plane)Yes
Mask-defined features on ground planeYes
Laser Direct Imaging (LDI)ColorsGreen, black, red, blue
GlossSemi-gloss
Min web for SMT.004″ (.102 mm)
Min web for BGA.0035″ (.089 mm)
Clearance.005″ (.126 mm)
Mask-defined SMT Or BGA (not ground plane)Yes
Legend mask parameters for HDI PCBs
TypeLegend mask parameterSierra Circuits capability
SprintColorWhite
Min line.050″ (1.27 mm)
Min height.025″ (.635 mm)
Screen PrintableColorsWhite, yellow, black, red
Min line.007″ (.178 mm)
Min height.030″ (.762 mm)
Surface finishes for HDI PCBs
Surface finishSierra Circuits capability
HASL (vertical & horizontal)Yes
Lead free HASLYes
OSP (Shikoku F2 & Entek)Yes
ENIG (electroless nickel / immersion gold)Yes
ENEPIG (electroless nickel-electroless paladium-immersion gold)Yes
Immersion silverYes
Tin nickelNo
Electrolytic soft goldYes
Electrolytic hard goldYes
Fabrication parameters for HDI PCBs
Fabrication parameterSierra Circuits capability
MechanicalMin route cutter available.021″ (.533 mm)
Routed part size tolerance<.010″ (.254 mm)
Counter sinkYes
Counter boreYes
Bevel angles20, 30, 45
LaserMilling, depth tolerance+/- .003″ (.076 mm)
Laser routed thickness<.032″ (.813 mm) thick
Routed arrayYes
V ScoreAngles30, 45, 60
Edge to copper.007″ (.178 mm)
DicingEdge to copper.005″ (.127 mm)
Edge / CastellationMin drill via.010″ (.254 mm)
Edge platingYes
Other screenable materials for HDI PCBs
Screenable materialSierra Circuits capability
Carbon inkYes
Peelable solder maskYes
Electrical tests available for HDI PCBs
Report typeSierra Circuits capability
Controlled impedance5% w/ F/A
Hi potYes
Test voltage40, 250, 500
Isolation resistance (Mohms)>100
Continuity resistance (Ohms)<.010
Min pad size.004″ (.102 mm)